Laser Welding Machine, PE-W700-B

Specification:
Spot size: 45-60um
Wafer Size (mm): 156.5x156.5 (6”) , 125x125 (5”)
Wafer thickness (μm): 150-220
Breakage rate: < 0.2%
CCD vision system for automatic alignment;
Air extraction and filtering equipment.
Auto loading & unloading system.
High reliability resulting in high uptime.
Stack or Cassette for option
Designed for 24 hours, 7 days operation.
Easy Operation

Laser Welding Machine, PE-W700-B
PE-W700-B

Laser Dielectric Ablation (inline system)
Laser Dielectric Ablation is the application of advanced metallization schemes in order to reduce shadow losses and series resistance losses. It is also done to improve contact to the emitter.

Samples:
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Other Products
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    CCD vision system for automatic alignment;
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