Laser Tapping Machine PEDB-600C

Technological Characteristics
Gantry type structure, bi-dimensional separation
RF Drive CO2 laser device
Servo motor drives ball screw transmission
Two way high speed scanning,galvanometer sync output
Special control software
Smoke dust removal system

Applicable
Cut and stamp PVC film for thin film solar cell, and extract electrode

Laser Tapping Machine PEDB-600C
PEDB-600C
Technical Parameter
Specification PEDB-600C
Efficient working area 1.1m ×1.4m (or 635mm ×1245mm )
Max scanning speed of galvanometer 7000mm /s
Max moving speed of working table 8000mm /s
Repeated positioning accuracy ±100μm
Tapping average efficiency 2 ~ 3holes/S
Feedback Form
Other Products
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  • Picosecond Laser Drilling and Marking Machine, PEDB-600A The picosecond laser drilling and marking machine is widely used in drilling, cutting and slicing of heat reactive and high hardness fragile materials. This drilling machine is suitable for micro hole drilling and fine cutting for OGS mobile covers, optic glass, sapphire substrate, ultrathin metal material, and ceramic substrate.
  • Ceramic Laser Cutting Machine, PEDB-600BThe PEDB600B ceramic laser cutting machine is applicable for cutting, slicing and drilling aluminum, aluminum nitride ceramic circuit substrate, silicon, germanium, gallium arsenide and other semiconductor backing materials. It is also applicable for cutting, drilling and slicing DPC, COB substrates and cutting sputtering plating substrates.