Fiber Laser Scribing Machine, PEDB-20H

New design: We have reconstructed the mechanical structure in order to make the laser scribing machine’s structure more compact, easier to use and more economically friendly. We have also rewritten the fiber laser scribing machine’s software source code in order to make the software run faster and easier.

High configuration: Using a 20W fiber laser, the beam quality has been improved (standard base model), the kerf is finer (30μm), and results in a smoother edge.

Maintenance free: the laser scribing machine has a standard modular design, allowing for a maintenance free, and uninterrupted, continuous operation. There is no need to replace worn out parts.

Easy operation: The laser scribing machine has integrated air cooled device settings, and the machine itself is smaller and features an easy operation.

Laser Scribing Machine, PEDB-20H
PEDB-20H

Control Software: The control software was developed specifically for laser scribing machines. It is easy to operate and can display a real time dicing path.

High efficiency: the maximum efficiency scribing speed reaches up to 200mm/s.

Application and Marketing
The laser scribing machine is suitable for scribing and cutting monocrystalline silicon, polycrystalline silicon, amorphous silicon cells, and dicing of silicon, germanium, and gallium arsenide semiconductor material.

Technical index
model specification PEDB-20H
Laser Power 20W
Laser Wavelength 1064nm
Precision Dicing ±10μm
Dicing linewidth ≤30μm
Laser repetition frequency 20KHz ~ 100KHz
Max scribing Speed 200mm /s
Working area 210mm ×210mm
Power Supply 220V/ 50Hz/ 2.5KVA
Cooling way Wind Cooling
Working table Single gas warehouse vacuum adsorption
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